Multilayer OEM Electronic Module Prototype Mobile Phone PCB & PCBA Assembly SMT DIP Manufacturer of Aluminum Electronic Modules

Multilayer OEM Electronic Module Prototype Mobile Phone PCB & PCBA Assembly SMT DIP Manufacturer of Aluminum Electronic Modules

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Product Details:

Min. Line Spacing 0.075mm
Test AOI, ICT, Functional Test, X-ray
Min. Line Width 0.075mm
Board Type Rigid, Aluminum-based
Insulation Resistance >10^12
Voltage Endurance 1500V AC/min
Hole Size Min 0.2mm
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Multilayer OEM Electronic Module Prototype Mobile Phone PCB & PCBA Assembly SMT DIP Manufacturer of Aluminum Electronic Modules Price And Quantity

Minimum Order Quantity 1 Pieces
Price Or Price Range INR

PCB Shape Regular and irregular/custom shapes
Assembly Tolerance 0.05mm
Component Mounting SMT (Surface Mount Technology) & DIP (Dual In-line Package)
PCBA Service Capability Prototype to mass production
OEM/ODM Service Available
Soldermask Thickness 10-30 um
Thermal Conductivity Up to 2.0 W/mK (for Aluminum PCB)
Max Board Weight Up to 80 oz copper
Assembly Process Lead-Free, RoHS Compliant
Operating Temperature Range -40C to +125C
Application Mobile phones, communication devices, automotive electronics, industrial modules

Multilayer OEM Electronic Module Prototype Mobile Phone PCB & PCBA Assembly SMT DIP Manufacturer of Aluminum Electronic Modules Product Specifications

Min. Line Spacing 0.075mm
Color Green, Blue, Black, Red, White
Insulation Resistance >10^12
Electrical Components SMT, DIP, QFN, BGA, THT, connectors, resistors, capacitors, ICs
Voltage Endurance 1500V AC/min
Number Of Layers 4 Layer, 6 Layer, 8 Layer, up to 16 Layers
Board Type Rigid, Aluminum-based
Copper Thickness 1oz - 3oz
Board Thickness 0.6mm - 3.2mm
Silkscreen White, Black, Yellow
Soldermask Green, Blue, Black, Red, White, Matt, Transparent
Product Type Multilayer OEM Electronic Module PCB & PCBA Assembly
Min. Line Width 0.075mm
Flame Resistance Level UL94-V0
Panel Size Customizable (Max. 600mm x 1200mm)
Test AOI, ICT, Functional Test, X-ray
Base Material FR4, Aluminum, Rogers
Hole Size Min 0.2mm
Sensor Switch Optional integration
Surface Finish OSP, ENIG, HASL, Immersion Silver/Tin, Gold plating
Impedance 10% controlled

PCB Shape Regular and irregular/custom shapes
Assembly Tolerance 0.05mm
Component Mounting SMT (Surface Mount Technology) & DIP (Dual In-line Package)
PCBA Service Capability Prototype to mass production
OEM/ODM Service Available
Soldermask Thickness 10-30 um
Thermal Conductivity Up to 2.0 W/mK (for Aluminum PCB)
Max Board Weight Up to 80 oz copper
Assembly Process Lead-Free, RoHS Compliant
Operating Temperature Range -40C to +125C
Application Mobile phones, communication devices, automotive electronics, industrial modules

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