Custom Shenzhen Factory's Double-Sided Gold Circuit Board Mobile Phone Motherboard PCBA Parts Processing

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Product Details:

Hole Size Min. 0.2mm
Board Type Rigid
Silkscreen White
Voltage Endurance 220-440 Volt (V)
Flame Resistance Level 94V-0
Impedance Controlled Impedance as per design
Min. Line Width 0.1mm
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Custom Shenzhen Factory's Double-Sided Gold Circuit Board Mobile Phone Motherboard PCBA Parts Processing Price And Quantity

Minimum Order Quantity 100 Piece

Lead Time 7-10 working days for prototypes
Operating Temperature -40°C to +85°C or customized
Component Sourcing Supported (full turnkey, consigned, or mixed)
Max. Board Size As per customer design (standard up to 600mm x 600mm)
PCBA Capability SMT+DIP, BGA, QFP, SOP, SOIC, Chip On Board, etc.
OEM/ODM Service Yes
Packing Vacuum packed, antistatic, bubble wrapped
Assembly Process Lead-Free/RoHS compliant soldering
Application Mobile phone motherboard PCBA
Storage Condition <25°C, <60% RH, avoid direct sunlight
Edge Plating Available as requested

Custom Shenzhen Factory's Double-Sided Gold Circuit Board Mobile Phone Motherboard PCBA Parts Processing Product Specifications

Test 100% E-test, AOI, functional test as needed
Surface Finish Gold finishing (ENIG)
Insulation Resistance >10^8
Warranty Yes
Soldermask Green
Base Material FR-4
Number Of Layers 2 Layers (double sided)
Panel Size Customized sizes
Sensor Switch Integrated as required
Copper Thickness 1oz / customized
Min. Line Spacing 0.1mm
Silkscreen White
Board Thickness Different available Millimeter (mm)
Impedance Controlled Impedance as per design
Min. Line Width 0.1mm
Voltage Endurance 220-440 Volt (V)
Flame Resistance Level 94V-0
Hole Size Min. 0.2mm
Color Green
Board Type Rigid
Product Type Double Sided PCB Boards
Electrical Components SMD, DIP components; as per BOM

Lead Time 7-10 working days for prototypes
Operating Temperature -40°C to +85°C or customized
Component Sourcing Supported (full turnkey, consigned, or mixed)
Max. Board Size As per customer design (standard up to 600mm x 600mm)
PCBA Capability SMT+DIP, BGA, QFP, SOP, SOIC, Chip On Board, etc.
OEM/ODM Service Yes
Packing Vacuum packed, antistatic, bubble wrapped
Assembly Process Lead-Free/RoHS compliant soldering
Application Mobile phone motherboard PCBA
Storage Condition <25°C, <60% RH, avoid direct sunlight
Edge Plating Available as requested

Custom Shenzhen Factory's Double-Sided Gold Circuit Board Mobile Phone Motherboard PCBA Parts Processing Trade Information

Payment Terms Cash in Advance (CID)
Supply Ability 5000 Piece Per Month
Delivery Time 7 Days
Main Export Market(s) Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa

Product Description

Discover the exclusive Custom Shenzhen Factory's Double-Sided Gold Circuit Board for mobile phone motherboard PCBA parts processing - a top-notch, acclaimed solution trusted by champions in the electronics industry. This monumental product boasts fresh innovation, offering SMT, DIP, COB, BGA, and custom capabilities. With lead-free/RoHS compliant soldering, high endurance, and integrated sensor switches, this PCBA delivers outstanding performance and reliability. OEM/ODM services, flexible assembly, and comprehensive testing ensure each board meets stringent global standards, making it the premier choice for professional mobile device manufacturing.

Precision Engineered for Mobile Excellence

Custom Shenzhen Factory's Double-Sided Gold Circuit Board is expertly engineered for use in mobile phone motherboard PCBA applications. Specifically designed for high-performance smartphones, these boards are utilized in champion devices requiring unparalleled dependability and efficiency. Used as the core foundation of the mobile device, this acclaimed component ensures stable operations and sustained device integrity, enabling advanced functionalities with reliability. It's the fresh solution for businesses seeking specialized PCBA for a diverse range of mobile innovations.

Sampling, Shipping, and Supply Powered by Efficiency

Sample availability empowers clients to assess the fresh innovation firsthand before full-scale deployment. With FOB port options for flexible global logistics, customers benefit from rapid, secure dispatching processes. The factory's robust supply ability meets monumental market demands while maintaining top-notch standards. Logistics expertise and systematic inventory management boost market value by ensuring timely deliveries, supporting diverse business timelines, and facilitating seamless integration into the client's value chain.

FAQ's of Custom Shenzhen Factory's Double-Sided Gold Circuit Board Mobile Phone Motherboard PCBA Parts Processing:

Q: How can I request a sample of the double-sided gold circuit board?

A: You can request a sample directly through our sales team or website contact form. We offer sample options so clients can review the quality and compatibility before placing larger orders.

Q: What is the typical lead time for prototype and mass production orders?

A: Prototypes are usually dispatched within 7-10 working days, while lead times for bulk orders may vary based on order complexity and quantity.

Q: What assembly processes and components does the factory support?

A: Our facility accommodates SMT, DIP, BGA, QFP, SOP, SOIC, and Chip On Board (COB). We handle both SMD and DIP components as specified in the client's BOM.

Q: Where and how are the finished PCBA boards shipped?

A: Boards are shipped globally from our FOB ports with secure vacuum packing, antistatic measures, and bubble wrap. Shipping methods are selected depending on customer location and urgency.

Q: What are the key advantages of choosing this PCBA solution for mobile applications?

A: Advantages include lead-free/RoHS assembly, gold finishing for enhanced durability, customizable sizes, strong insulation resistance, and comprehensive testing for quality assurance.

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