Custom Shenzhen Factory's Double-Sided Gold Circuit Boards Mobile Phone Motherboard Parts Processing PCBA Genre

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Product Details:

Min. Line Spacing 0.1mm
Impedance Custom controlled impedance available
Min. Line Width 0.1mm
Soldermask Green
Silkscreen White
Flame Resistance Level UL94-V0
Voltage Endurance 220-440 Volt (V)
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Custom Shenzhen Factory's Double-Sided Gold Circuit Boards Mobile Phone Motherboard Parts Processing PCBA Genre Price And Quantity

Minimum Order Quantity 100 Piece

Processing Service SMT, DIP, PCBA assembly
RoHS Compliance Yes, RoHS Certified
PCB Standard IPC-A-600 Class 2/Class 3
Lead Time 7-10 working days
Component Sourcing OEM/ODM support
Application Mobile phone motherboard, consumer electronics
MOQ No minimum order quantity
Assembly Type Surface Mount Technology (SMT) & Through-Hole
OEM/ODM Service Supported
Outline Tolerance ±0.1mm
Packing ESD safe packaging

Custom Shenzhen Factory's Double-Sided Gold Circuit Boards Mobile Phone Motherboard Parts Processing PCBA Genre Product Specifications

Base Material FR4
Color Green
Sensor Switch Not Included
Voltage Endurance 220-440 Volt (V)
Flame Resistance Level UL94-V0
Silkscreen White
Number Of Layers 2
Test 100% E-testing & AOI
Soldermask Green
Impedance Custom controlled impedance available
Product Type Double Sided PCB Boards
Copper Thickness 1 oz (Customizable)
Surface Finish Immersion Gold (ENIG)
Electrical Components Mounted as per BOM
Min. Line Width 0.1mm
Min. Line Spacing 0.1mm
Board Type Rigid Double-Sided
Hole Size Min 0.2mm
Panel Size Custom as per requirement
Warranty Yes
Board Thickness Different available Millimeter (mm)
Insulation Resistance >10^12

Processing Service SMT, DIP, PCBA assembly
RoHS Compliance Yes, RoHS Certified
PCB Standard IPC-A-600 Class 2/Class 3
Lead Time 7-10 working days
Component Sourcing OEM/ODM support
Application Mobile phone motherboard, consumer electronics
MOQ No minimum order quantity
Assembly Type Surface Mount Technology (SMT) & Through-Hole
OEM/ODM Service Supported
Outline Tolerance ±0.1mm
Packing ESD safe packaging

Custom Shenzhen Factory's Double-Sided Gold Circuit Boards Mobile Phone Motherboard Parts Processing PCBA Genre Trade Information

Payment Terms Cash in Advance (CID)
Supply Ability 5000 Piece Per Month
Delivery Time 7 Days
Main Domestic Market All India

Product Description

Custom Shenzhen Factory's Double-Sided Gold Circuit Boards represent a top-rated and cost-effective solution for mobile phone motherboard parts processing. Crafted with virtuoso precision, these outstanding PCBA assemblies utilize splendid surface mount technology (SMT) and through-hole capabilities. Ephemeral lead times-just 7-10 working days-ensure quick delivery. OEM/ODM support, customizable options, and no MOQ make it ideal for consumer electronics. FR4 rigid boards, ENIG surface finish, RoHS compliance, and comprehensive testing offer reliability and superior performance. Choose Shenzhen Factory for exceptional quality, technical prowess, and dependable service.

Competitive Advantages of Custom Shenzhen Double-Sided Gold Circuit Boards

Experience a distinct advantage with our splendid double-sided gold circuit boards tailored for mobile phone motherboards. Outstanding outline tolerance of 0.1mm and IPC-A-600 Class 2/Class 3 standards guarantee superb reliability. Virtuoso SMT and DIP processing ensure flawless assembly, while expansive OEM/ODM support offers unlimited customization. Our cost-effective approach, rapid lead times, and no minimum order quantity create an excellent value proposition for suppliers and manufacturers seeking top-rated performance and flexibility.

Packaging and Delivery Information

Custom Shenzhen Factory products are packed in ESD-safe packaging to guarantee protection during transit. We offer express shipping services to expedite delivery in the main domestic market, including Vietnam. Orders are dispatched within 7-10 working days, ensuring timely arrival and minimal waiting periods. No charge for standard ESD packing, and we offer competitive shipping rates on all orders. Benefit from our commitment to secure packaging and swift order processing for outstanding customer satisfaction.

FAQ's of Custom Shenzhen Factory's Double-Sided Gold Circuit Boards Mobile Phone Motherboard Parts Processing PCBA Genre:

Q: How does the processing service for these PCBA circuit boards work?

A: Our processing service employs surface mount technology (SMT) and through-hole (DIP) assembly, following your bill of materials (BOM). Each board undergoes 100% E-testing and AOI inspection, ensuring outstanding quality and reliability for mobile phone motherboard and consumer electronics applications.

Q: What are the benefits of choosing Shenzhen Factory's double-sided gold circuit boards?

A: You gain a top-rated product with high insulation resistance, fast lead times, cost-effective manufacturing, and customizable specifications. OEM/ODM support and stringent quality standards ensure that your designs achieve splendid performance and longevity.

Q: When will my order be shipped after placing a request?

A: Orders are processed and dispatched within 7-10 working days, with express shipping options available for rapid delivery to the main domestic markets such as Vietnam and other global destinations.

Q: Where can I use these double-sided gold circuit boards?

A: These outstanding PCBA boards are primarily designed for mobile phone motherboards but are also suitable for various consumer electronics applications that require reliable, flame-resistant, and high-performance circuit assemblies.

Q: What packaging options are available for shipping the circuit boards?

A: We offer ESD-safe packaging for all shipments, ensuring protection against static damage during transportation. Standard packing is provided at no extra charge, with express delivery options available as needed.

Q: How is component sourcing handled for custom orders?

A: We support both OEM and ODM sourcing for electrical components, working closely with clients to ensure all parts are procured and assembled accurately according to the specified BOM and project requirements.

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